Element Six unveils copper diamond composite to power advanced semiconductor devices

At Photonics West 2025 in Santa Clara, CA, USA (25–30 January), chemical vapor deposition (CVD)-based synthetic diamond materials firm Element Six of Oxford, UK (E6, part of the De Beers Group) is launching an innovative Cu-diamond product, a copper-plated diamond composite material that has high thermal and electrical conductivity. Designed to address the increasingly critical thermal management challenges in advanced semiconductor devices, the cost-effective solution is said to enable greater performance and reliability for applications such as AI, high-performance computing (HPC), and gallium arsenide (GaN) RF devices...Weiter zum vollständigen Artikel bei Semiconductor Today Weiter zum vollständigen Artikel bei Semiconductor Today