Driving Innovation: DuPont Highlights Advanced Circuit Solutions at Intelligent Asia Thailand 2025

BANGKOK, March 5, 2025 /PRNewswire/ -- DuPont is excited to showcase its cutting-edge advancements in circuit materials at Intelligent Asia Thailand 2025. With a broad array of solutions designed to enhance fine-line technology, signal integrity, and thermal management, DuPont will be exhibiting at Booth #B342 in EH 102 at the Bangkok International Trade & Exhibition Centre (BITEC) from March 6 to 8, 2024.

"Artificial intelligence (AI) is significantly transforming the electronics industry, accelerating innovation speed in printed circuit boards (PCBs) that are essential for intelligent devices," said Yuan Yuan Zhou, Global Business Director, Advanced Circuit & Packaging, DuPont. "As a leader in advanced interconnect technology, our expertise and broad product portfolio positions us to enable the increasing needs for device miniaturization and high computational speed and performance. Through strategic partnerships and our global presence, we help our customers, leading PCB manufacturers, start and grow their business in the rapidly expanding Southeast Asian market."

Innovations in printed circuit boards (PCBs) are accelerating at an unprecedented pace, with advanced high-density interconnects and fine-line technology playing a crucial role in network communications, automotive and consumer electronics sectors. As the automotive industry transitions toward electrification and automation, and the 5G infrastructure and server technologies expand, both sectors require technology advancements in advanced multilayer boards (MLBs) and high-density interconnects (HDIs) with high reliability interconnect.

To meet these evolving technology challenges, DuPont offers state-of-the-art materials for flexible, rigid-flex, and rigid PCBs, enabling the seamless integration of complex circuits. DuPont's innovative solutions encompass both high-performance chemistry that addresses fine pitch and advanced reliability requirements, as well as comprehensive signal integrity offerings designed for high-frequency and high-speed data transfer applications. These products effectively tackle industry challenges, ensuring optimal performance, efficient power transmission, and reliable signal integrity.

At the event, DuPont experts will be available at the company's booth to share their extensive knowledge and insights on technological advancements and industry trends. Attendees will have the opportunity to explore DuPont's full range of solutions. Product offerings include: 

DuPont™ Copper Gleam™ PPR-II/III pulse acid plating copper is a new generation electroplating solution designed for advanced MLB, high-layer count boards, and AI server station applications. The solution has superior throwing power for through-hole plating, with better plated thickness distribution on surface to fulfill fine-line and high reliability requirements.  

DuPont™ Circuposit™ 6800W electroless copper plus Copper Gleam™ PS-100flash copper are designed for enhanced reliability performance in multi-stack micro-via designs, replacing conventional electroless copper processes. The combination of a horizontal electroless copper process with a flash electroplating step creates a more efficient single process solution, making it well-suited for applications in automotive and AI server stations.

DuPont™ Riston^® DI9500M & DI8600 and FD3000M dry film photoresist are multi-wavelength direct imaging solutions designed for use in pitch greater than or equal to 70μm tech/etch processes for both rigid and flex PCBs. These dry film photoresists are ideal for applications in electrified automotive and AI server stations. They provide fine-line capability with excellent resolution and adhesion performance, improving overall yield for manufacturers.

DuPont™ Microfill™ EVF-III acid copper is a new generation via-filling technology designed for fine-line HDI applications suitable for automotive applications. The solution is highly effective for panel via filling, providing excellent throwing power for improved through-hole performance.  

DuPont™ Pyralux^® AP flexible copper-clad laminate is a versatile, double-sided laminate that features an all-polyimide dielectric and DuPont's unique manufacturing process. This laminate offers exceptional reliability and reduced transmission loss. With its tailored combination of properties, it fulfills customers' requirements for high reliability and high-speed, high-frequency signal transmission.  

About DuPont 
DuPont (NYSE: DD) is a global innovation leader with technology-based materials and solutions that help transform industries and everyday life. Our employees apply diverse science and expertise to help customers advance their best ideas and deliver essential innovations in key markets including electronics, transportation, construction, water, healthcare and worker safety. More information about the company, its businesses and solutions can be found at www.dupont.com. Investors can access information included on the Investor Relations section of the website at investors.dupont.com. 

DuPont™, the DuPont Oval Logo, and all trademarks and service marks denoted with ™, ^SM or ^® are owned by affiliates of DuPont de Nemours, Inc. unless otherwise noted. 

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SOURCE DuPont